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Title

STRUCTURAL, CHEMICAL AND MORPHOLOGICAL PROPERTIES OF TITANIUM INSERTED COPPER NITRIDE NANO-CRYSTALLINE THIN FILMS

Writers

RAHMATI ALI

Pages

 Start Page | End Page

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Abstract

 TI INSERTED COPPER NITRIDE (TI: CU3N) THIN FILMS WERE DEPOSITED ON SI (111) SUBSTRATES USING A BINARY TI13CU87 ALLOYED TARGET BY REACTIVE DC MAGNETRON SPUTTERING AT NITROGEN AMBIENT ATMOSPHERE. THIS STUDY PROVIDES INSIGHT INTO THE IMPORTANCE OF NITROGEN PRESSURE ON THE CHARACTERISTIC OF THE AS-DEPOSITED TI: CU3N THIN FILMS. PHASE ANALYSIS OF THESE FILMS WAS IDENTIFIED BY X-RAY DIFFRACTION (XRD) TECHNIQUE. THE FILMS INDICATE GOOD CRYSTALLINITY WITH TI SUBSTITUTED CU SITES AND VACANCIES IN THE CU3N STRUCTURE. FOR ATOMIC TI: CU RATIO PREDICTION IN THE FILMS, A MODEL HAS BEEN INTRODUCED BASED ON SEMI-EMPIRICAL FORMULATION OF SPUTTERING. THE ATOMIC TI: CU RATIO IS LESS THAN THAT OF THE ORIGINAL TARGET AND IT DEPENDS ON MAGNETRON DISCHARGE CHARACTERISTICS.TI ADDITION AND SUBSEQUENT EXCESS OF INTERSTITIAL NITROGEN (N- RICH), RESULTS IN LATTICE CONSTANT EXPANSION IN COMPARISON WITH TI FREE CU3N AND GRAIN GROWTH SUPPRESSION.

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