Paper Information

Title: 

THE TARGET POISONING IN THE PLASMA REACTIVE DEPOSITION

Type: PAPER
Author(s): MIRZAYE TAGHI,HOSEIN ZAHED
 
 
 
Name of Seminar: NATIONAL VACUUM CONFERENCE IRAN
Type of Seminar:  CONFERENCE
Sponsor:  PAZHOHESHKADE OLOM VA SANAYE GHAZAEE
Date:  2012Volume 5
 
 
Abstract: 

THE INTEREST IN DUSTY PLASMA RESEARCH, WHICH IS A RELATIVELY NEW FIELD IN PLASMA PHYSICS, HAS INCREASED WITH THE DEVELOPMENT OF MICROELECTRONICS AND SURFACE ENGINEERING. THE DUST PARTICLES APPEAR AS POLLUTANT IN THIS INDUSTRIAL PROCESSING. RECENTLY, HOWEVER, THEY ARE SEEN FROM A DIFFERENT POINT OF VIEWS – THEY CAN BE USEFUL IN COATINGS VARIOUS TECHNOLOGIES. ONE THE TYPE OF DEPOSITION IS PLASMA REACTIVE SPUTTERING. THE TARGET POISONING IN THE PROCESSES DEPOSITION FOR REACTIVE SPUTTERING IS IMPORTANT. THE RESULTANT OF TARGET POISONING IS INSTABILITY IN THE SYSTEM. THERE HAVE VERY INFLUENCE ON THE ELECTRICAL, OPTICAL AND CONSTRUCTION PROPERTIES. THE STOCHIOMETRY IS CHANGING ALONG TARGET POISONING.

 
Keyword(s): 
 
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