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Paper Information

Title: 

EXPERIMENTAL INVESTIGATION OF CU AND AL DEPOSITION USING SPUTTERING METHOD

Type: PAPER
Author(s): NOFEREST A.A.,ENTEZAMI PAZHOH M.,SAYEDI S.S.
 
 
 
Name of Seminar: NATIONAL VACUUM CONFERENCE IRAN
Type of Seminar:  CONFERENCE
Sponsor:  PAZHOHESHKADE OLOM VA SANAYE GHAZAEE
Date:  2012Volume 5
 
 
Abstract: 

THE UNDERSTANDING OF THE PARAMETERS WHICH AFFECTS THE FILM THICKNESS DISTRIBUTION AND THE TARGET BEHAVIOR DURING DEPOSITION AND THE WAY IT AFFECTS FILM PROPERTIES WILL UNEQUIVOCALLY IMPROVE COATINGS PROPERTIES. THIS PAPER EXAMINES THE DEPOSITION OF CU COATING IN BOTH HIGH AND VERY LOW RANGE OF PRESSURE, EXPERIMENTALLY. THE THICKNESS DISTRIBUTION OF THE ALUMINUM COATING HAS BEEN STUDIED USING DC MAGNETRON SPUTTERING METHOD, TOO. THE EXPERIMENTAL RESULTS COMPARE WELL WITH THOSE OBTAINED BY THEORETICAL METHODS GIVEN THE DC MAGNETRON SPUTTERING MODELS USED FOR THE STUDY. IN BOTH PRESSURE RANGES, FILM UNIFORMITY DEPENDS ON THE LOCATION OF THE SUBSTRATE. THE EFFECT OF PRESSURE, TARGET MATERIAL AND CURRENT ON THE SCATTERING IS ILLUSTRATED DIAGRAMMATICALLY AND THE VALIDITY OF PRESENTED MODEL IN BOTH PRESSURE RANGES ARE PROVED.

 
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