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Paper Information

Title: 

INVESTIGATION ON ELECTROPLATED NI/CU OHMIC CONTACT ON MULTICRYSTALLINE SILICON FOR SOLAR CELLS

Type: PAPER
Author(s): MANAVIZADEH N.,SAFA ISINI R.,ASL SOLEIMANI E.,DEHGHAN NAYYERI F.,MOHAJERZADEH S.,GHAFOORI FARD H.
 
 
 
Name of Seminar: IRAN PHYSICS CONFERENCE
Type of Seminar:  CONFERENCE
Sponsor:  PHYSICS SOCIETY OF IRAN
Date:  2005Volume -
 
 
Abstract: 

IN THIS PAPER THE NI/CU CONTACT STRUCTURE ON MULTI CRYSTALLINE SILICON IS INVESTIGATED. THIS STRUCTURE HAS LOW COST, LOW RESISTANCE, ITS ADHESION TO THE SUBSTRATE IS GOOD AND ITS FABRICATION IS EASY. IN THIS STRUCTURE NI IS USED AS A BARRIER TO PREVENT DIFFUSION OF CU INTO SILICON SUBSTRATE AND ALSO TO FORM AN OHMIC CONTACT. CU IS USED DUE TO ITS LOW ELECTRICAL RESISTIVITY AND HIGH RESISTANCE TO ELECTRO MIGRATION.

 
Keyword(s): 
 
 
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