Paper Information

Journal:   INTERNATIONAL JOURNAL OF INDUSTRIAL ENGINEERING AND PRODUCTION MANAGEMENT (IJIE) (INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE) (PERSIAN)   Summer 2003 , Volume 14 , Number 2; Page(s) 1 To 20.
 
Paper: 

INVESTIGATION OF THERMAL CONDUCTIVITY AND OXIDATION BEHAVIOUR OF REACTION BONDED ALUMINUM NITRIDE (RBAN) CERAMICS

 
 
Author(s):  SALAHI E.*, MOZTARZADEH F., MARGHUSIAN V., HEINRICH J.G.
 
* 
 
Abstract: 
ALN samples have been produced by reaction bonding process using ALN and aluminum powders as starting materials. Different aluminum nitride and aluminum powders ratios were mixed in ethanol media, dried, isostatically pressed and nitrided in N__2 atmosphere. Results showed that the conversion of Al to ALN depends strongly on the amount of aluminum starting powder and decreased with increasing of aluminum after a maximum at 25 Al wt %. Changing the particle size and morphology of the aluminum starting power leads to change in the conversion ratio and microstructure of RBAN ceramics. Typical scanning electron micrographs of RBAN sample indicating primary and secondary aluminum nitride morphology and pore structure. The oxidation behavior of RBAN samples showed the weight gain depends on the average particle size, morphology and amount of Al in starting mixture and pore structure. Samples have been manufactured with equi-axed morphology of Al starting power have thermal conductivity higher than the samples have been manufactured with flake-like morphology. These differences were directly related to the different microstructure of RBAN samples.
 
Keyword(s): MICROSTRUCTURE, OXIDATION, THERMAL CONDUCTIVITY, REACTION BONDING, ALUMINUM NITRIDE MORPHOLOGY
 
References: 
  • ندارد
 
  Yearly Visit 35
 
Latest on Blog
Enter SID Blog