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Paper Information

Journal:   JOURNAL OF SCIENCE AND TECHNOLOGY OF COMPOSITES (JSTC)   FEBRUARY 2017 , Volume 3 , Number 4; Page(s) 351 To 358.
 
Paper: 

STUDY OF THE INFLUENCE OF TEMPERATURE AND NANOSILICA ON CURING BEHAVIOR AND CURE KINETICS MODELLING OF AN EPOXY RESIN SYSTEM

 
 
Author(s):  NIKZAMIR MAHDIEH, MORTEZAEI MEHRZAD*
 
* 
 
Abstract: 

Compared to thermoplastic, thermoset matrix composites and thermoset processes is more complex and less controllability.
Cure kinetics, determine the network morphology in which the mechanical and physical properties of cured product may be assessed. So, knowing of thermoset curing kinetics is essential to process development, quality control and achieve desirable products. Hence, in this work, cure kinetics of an epoxy resin EPON/828 curing agent dicyandiamide / accelerator Duran system for the production of the epoxy/glass fiber prepreg using in wind turbine blades. For this, curing epoxy system was carried out using Differential Scanning Calorimetry and the effect of temperature and the nanosilica weight percent studied. To investigate the effect of temperature, isothermal DSC test was carried out at five different temperature without the presence of nanoparticles and to assess the influences nanosilica with 0, 4 and 6 weight percentage is done. Obtained figures by MATLAB curve fitting were fitted well with autocatalytic Kamal model and model parameters achieved for each tested sample. Results showed an increase in temperature of the isothermal test, leads the increase of the rate of cure and the complete of curing process. Addition of nanosilica cause the increase of the rate of cure at low value a but delay at the beginning of cure and decrease significantly overall heat of reaction.

 
Keyword(s): EPOXY RESIN, CURE KINETICS, NANOSILICA, AUTOCATALYTIC KAMAL MODEL
 
References: 
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